Placa de baza Intel G33 cu procesor dual core Xeon 2.33ghz 4mb cache

Placa de baza Intel DG33BU cu procesor dual core Intel Xeon 2.33ghz 4mb cache fsb 1333mhz,placa vine insotita de tablita(I/0 shield).Specificatiile complete le puteti gasi mai jos:
Specifications
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Essentials
Status End of Interactive Support
Launch Date Q2'07
Board Form Factor microATX
Socket LGA775
Recommended Customer Price $96.00 - $99.00
Datasheet Link
Board Chipset Intel® G33 Express Chipset (Intel® 82G33 Graphics and Memory Controller)
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Memory Specifications
Max Memory Size (dependent on memory type) 8 GB
Memory Types DDR2-800/677
# of Memory Channels 2
# of DIMMs 4
ECC Memory Supported ‡ No
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Graphics Specifications
Integrated Graphics ‡ Yes
Graphics Output VGA
# of Displays Supported ‡ 2
Discrete Graphics PCIe x16
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Expansion Options
PCI Support 2
PCIe x1 Gen 2.x 1
PCIe x4 Gen 2.x 0
PCIe x8 Gen 2.x 0
PCIe x16 Gen 2.x 1
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I/O Specifications
USB 2.0 Configuration (Back + Internal) 6+6
Total # of SATA Ports 4
# of eSATA Ports 0
RAID Configuration N/A
# of PATA Ports 1
# of Parallel Ports 0
# of Serial Ports 1
Audio (back channel + front channel) 6-ch
Integrated LAN 10/100/1000
Firewire 1+1
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Package Specifications
Max CPU Configuration 1
Low Halogen Options Available See MDDS
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Advanced Technologies
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No
Intel® vPro Technology ‡ No
Intel® ME Firmware Version N/A
Intel® Remote Wake Technology No
Intel® Remote PC Assist Technology No
Intel® CIRA Technology No
TPM No
Intel® Quiet System Technology Yes
Intel® HD Audio Technology No
Intel® Matrix Storage Technology No
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Intel® Platform Protection Technology
Trusted Execution Technology ‡ No
Anti-Theft Technology No

Specificatii procesor:
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Essentials
Status Launched
Launch Date Q4'07
Processor Number 3065
# of Cores 2
Clock Speed 2.33 GHz
L2 Cache 4 MB
FSB Speed 1333 MHz
FSB Parity No
Instruction Set 64-bit
Embedded Options Available
No
Lithography 65 nm
Max TDP 65 W
VID Voltage Range 0.8500V-1.500V
Recommended Customer Price N/A
Datasheet Link
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Package Specifications
TCASE 72°C
Package Size 37.5mm x 37.5mm
Processing Die Size 143 mm2
# of Processing Die Transistors 291 million
Sockets Supported PLGA775
Low Halogen Options Available See MDDS
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Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® Hyper-Threading Technology ‡
No
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® 64 ‡
Yes
Idle States Yes
Enhanced Intel SpeedStep® Technology
Yes
Intel® Demand Based Switching
No
Thermal Monitoring Technologies Yes
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Intel® Platform Protection Technology
Trusted Execution Technology ‡
Yes
Execute Disable Bit ‡ Yes