DESKTOP -procesor i7-3770 -3,40 Ghz 4 Core, Socket 1155 -4Gb RAM -500GB -7200RPM
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Produs:Aproape Nou, Fără garanție
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Numar articol:174736445
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Preț:2.000,00 Lei
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Specificatii
Desktop - procesor i7-3770 CPU @ 3,40 Ghz 4 Cores(s), 8
Logical Procesors socket 1155 - 4Gb RAM - 500GB
-7200RPM
Stare produs: Aproape Nou
Model procesorIntel 3rd gen Core i7Frecventa procesorPeste
3000 MhzSocket1155
Memorie RAM4 GB
Capacitate hard disk500GB
Sistem Operare: la alegere
1. Procesor - placa video integrata (merg filmele ful HD,
etc) Procesor Intel(R) Core(TM) i7-3770 CPU @ 3,40 Ghz, 3901 Mhz,
4Cores(s), 8 Logical Procesors
2. Placa de baza -Gigabyte ga-h77-ds3h –
3. Carcasa - Thermaltake Versa II fara sursa
vo700a1n3n
4. Sursa - Modulara Thermaltake Smart SE 630W
sps-630m
7. DVD - writer LG
8. placute RAM - 4GB - Memorie Kingston 2GB 1600MHz DDR3
Non-ECC CL9 DIMM HyperX Blu
9. hard disk 500 GB -Hard disk WD blue 500GB -16mb cache
-7200rpm
1.Intel Core i7-3770 specifications
General information
Type CPU / Microprocessor
Market segment Desktop
Family Intel Core i7
Model number ? i7-3770
CPU part numbers
CM8063701211600 is an OEM/tray microprocessor
BX80637I73770 is a boxed processor (English
version)
BXC80637I73770 is a boxed processor (Chinese
version)
Frequency ? 3400 MHz
Turbo frequency 3900 MHz (1 or 2 cores)
3800 MHz (3 cores)
3700 MHz (4 cores)
Bus speed ? 5 GT/s DMI
Clock multiplier ? 34
Package 1155-land Flip-Chip Land Grid Array
Socket Socket 1155 / H2 / LGA1155
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Weight 1oz / 27.2g (CPU)
13oz / 368.6g (box)
Fan/heatsink E97378-001
Introduction date April 23, 2012 (announcement)
April 29, 2012 (launch)
S-spec numbers
ES/QS processors Production processors
Part number QC1W SR0PK
BX80637I73770 +
BXC80637I73770 +
CM8063701211600 + +
Architecture / Microarchitecture
Microarchitecture Ivy Bridge
Processor core ? Ivy Bridge
Core stepping ? E1 (SR0PK)
Manufacturing process 0.022 micron
Data width 64 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size ? 4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size ? 4 x 256 KB
Level 3 cache size 8 MB shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Features
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
?
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
F16C / 16-bit Floating-Point conversion
instructions
EM64T / Extended Memory 64 technology / Intel 64 ?
NX / XD / Execute disable bit ?
HT / Hyper-Threading technology ?
TBT 2.0 / Turbo Boost technology 2.0 ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
TXT / Trusted Execution technology
Low power features Enhanced SpeedStep technology ?
Integrated peripherals / components
Integrated graphics
GPU Type: HD 4000
Base frequency (MHz): 650
Maximum frequency (MHz): 1150
The number of supported displays: 3
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
Maximum memory bandwidth (GB/s): 25.6
Other peripherals
Direct Media Interface 2.0
PCI Express 3.0 interface
Electrical / Thermal parameters
Maximum operating temperature ? 105°C
Thermal Design Power ? 77 Watt
2.Placa de baza Gigabyte GA-H77-DS3H
Specificatii tehnice
Denumire: Placa de baza Gigabyte
GA-H77-DS3H
Cod producator: GA-H77-DS3H
General
Recomandat pentru Gaming: Nu
Format
ATX
Soclu procesor 1155
Producator chipset Intel
Model chipset
H77
BIOS
2 x 64 Mbit flash Use of licensed AMI EFI BIOS Support for
DualBIOS PnP 1.0a, DMI 2.0, SM BIOS 2.6, ACPI 2.0a
Interfata grafica
PCI Express x16 3.0
Raid
0, 1, 5, 10
Placa video integrata
Necesita procesor cu tehnologia Intel HD Graphics
Placa audio integrata
Chipset audio
Realtek ALC887
Placa retea integrata
10/100/1000 Gigabit LAN by Atheros
Chipset retea
Qualcomm Atheros
Numar SATA-II
3
Numar SATA-III - 2
mSATA - 1
Altele
Pentru suport memorii XMP, placa de baza trebuie echipata cu
procesor Intel 22nm. Pentru suport PCI Express 3.0 placa de baza
trebuie echipata cu procesor Intel 22nm.
Memorii Suportate
Tip memorie
DDR3
Memorie maxima - 32 GB
Numar sloturi - 4
Tehnologie
Dual channel
Frecvente suportate
1600/1333/1066 MHz
Sloturi
PCI Express 3.0 x16
1 (x16)
PCI Express 2.0 x16
1 (x4)
PCI Express x1= 2
PCI - 2
Multi-GPU CrossfireX
Supports AMD CrossFireX Technology
Conectori Back Panel
PS/2 Mouse-Tastatura - 1
VGA - 1
DVI - 1
HDMI - 1
RJ-45 LAN- 1
USB 2.0 - 4
USB 3.0 - 2
Suport audio
3. Descriere Carcasa Thermaltake Versa II fara
sursa vo700a1n3n
Thermaltake Versa II, SGCC Steel ATX Mid Tower, fara sursa,
interior vopsit in negru, 3x5.25”, 1x3.5”, 5x3.5” (intern), design
tool-less, front – 1x 120mm fan (optional), rear – 1x 120mm fan
(inclus), bottom – 1x 120mm fan (optional), top – 2x 120mm fan
(optional), side – 2x 120mm fan (optional), 1x USB 3.0, 1x USB 2.0,
HD Audio, ATX / microATX, dimensiuni: 429 x 196 x 481 mm
Caracteristici Carcasa Thermaltake Versa II fara sursa
vo700a1n3n
Tip:
Middle Tower
Sursa
Fara Sursa
Pozitionare Sursa:
Jos
Sistem de racire
Top (Exhaust): 120 x 120 x 25 mm fan x2 (Optional), Side
(Intake): 120 x 120 x 25 mm fan (Optional), Rear (Exhaust): 120 x
120 x 25 mm, Front (Intake): 120 x 120 x 25 mm fan (Optional),
Bottom (Intake): 120 x 120 x 25 mm fan (Optional)
Format:
Micro ATX,ATX
Panou frontal:
USB2.0 X 1, Audio ports
Culoare:
Negru
Material:
SGCC
Dimensiuni (W x H x D mm):
429 x 196 x 481 mm
Greutate (Kg): 3
Altele:
Sloturi expansiune: 7, VGA length limitation: 320mm, Interior
vopsit in negru, CPU cooler height limitation: 155mm
Capabil racire lichida: Da
Racire lichida inclusa: Nu
4. Descriere Sursa Modulara Thermaltake Smart SE 630W
sps-630m
Thermaltake Smart SE 630W Modular PSU, eficienta 87%, cabluri
modulare plate pentru un wire management mai bun, single rail
(49A), ventilator silentios de 140mm cu control termic automat, 2x
6 2pin PCIE, 6x SATA, 3x Molex, 1x Floppy, 1x 4 4pin EPS12V,
SCP/OVP/OCP/OPP/UVP, Active PFC, dimensiuni: 150mm(W) x 86mm(H) x
160mm(D)
Caracteristici Sursa Modulara Thermaltake Smart SE 630W
sps-630m
Putere sursa (W):
630
Sistem de racire:
1x 140 mm
Auto fan control:
Da
Eficienta:
87 %
Conectori modulari:
Da
Certificari:
CE, TUV, GOST
MTBF:
100,000 h minimum
Dimensiuni:
150mm(W) x 86mm(H) x 160mm(L)
Culoare:
Negru
Conectori
Tip conector ATX:
20 Pin ATX
CPU 4+4 pini:
1
SATA:
6
Molex:
3
Floppy:
1
PCI Express 8 pini:
2
Output
+3.3 V:
20 A
+5 V:
18 A
+12 V:
49 A
-12 V:
49 A
+5 Vsb:
5. Boxe A4Tech SoundStar
Model
Producator A4Tech
Model SoundStar
Code AS-6 (Black)
Specificatii tehnice
Tip Stereo
Putere (PMPO) 120 W
Putere totala (RMS) 12 W
Putere Sateliti (RMS) 2 x 6 W
Raspuns in frecventa 80 Hz - 20 kHz
Raport semnal / zgomot (SNR) 55 dB
Intrari 3.5mm Jack
Iesire casti 3.5mm Da
Greutate 0.96 kg
Alte detalii LED indicator, Protectie
Magnetica
8. PLACUTE RAM
Specificatii
Memorie Kingston 2GB 1600MHz DDR3 Non-ECC CL9 DIMM HyperX
Blu
Cod: KHX1600C9AD3B1/2G
General
Tip memorie:
DDR3
Capacitate:
2048 MB
Frecventa (MHz):
1600
Altele
Latenta:
CL9
Radiator:
Da
KHX1600C9AD3B1/2G
2GB 1Rx8 256M x 64-Bit DDR3-1600
CL9 240-Pin DIMM
DESCRIPTION
This document describes Kingston's 256M x 64-bit
(2GB)
DDR3-1600 CL9 SDRAM (Synchronous DRAM), 1Rx8
memory
module, based on eight 256M x 8-bit FBGA components.
This
module has been tested to run at DDR3-1600 at a low
latency
timing of 9-9-9 at 1.65V.The SPD is programmed to
JEDEC
standard latency DDR3-1333 timing of 9-9-9. This
240-pin
DIMM uses gold contact fingers. The JEDEC electrical
and
mechanical specifications are as follows:
Document No. 4805800-001.C00 06/08/12 Page 1
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power 2.160 W*
UL Rating 94 V - 0
Operating Temperature 0o
C to 85o C
Storage Temperature -55o
C to +100o C
*Power will vary depending on the SDRAM used.
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power
Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1
clock
• Programmable CAS Write Latency(CWL) = 7
(DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential
with
starting address “000” only), 4 with tCCD = 4 which does
not
allow seamless read or write [either on the fly using A12
or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration
through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE
85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), single sided
component
Memory Module Specifi cations
Continued >>MODULE DIMENSIONS
Document No. 4805800-001.B00 Page 2
MODULE WITH HEAT SPREADER
continued HyperX
All Kingston products are tested to meet our published
specifications. Some motherboards or system configurations may not
operate at
the published HyperX memory speeds and timing settings.
Kingston does not recommend that any user attempt to run their
computers
faster than the published speed. Overclocking or modifying
your system timing may result in damage to computer
components.
FOR MORE INFORMATION, GO TO
9. HARD DISK
Specificatii
HDD WD Blue 500GB, 7200rpm, 16MB, SATA 3
Cod: WD5000AAKX
Capacitate:
500 GB
Viteza de rotatie:
7200 rpm
Buffer: - 16 MB
Interfata: - SATA 3
Rata de transfer SATA: - 600
MB/s
Dimensiuni (W x D x H):
Greutate: -450 g
Pret: 1700 ron
Modalitati de livrare si plata
LIVRARE
In Bucuresti
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PLATA
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Politica de retur
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