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Bga reballing

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BGA Reballing Mechanic iSmt Steel Stencil iPhone X - Șablon Reflow Cip, Accesorii Reparații GSM

BGA Reballing Mechanic iSmt Steel Stencil iPhone X - Șablon Reflow Cip, Accesorii Reparații GSM

84,58 Lei
Livrare gratuita la comenzile de 375 lei
Livrare Luni, 30 Mar
BGA Reballing Mechanic, iBGA Max 6 in 1, iPhone X, Xs, Xs Max, 11, 11 Pro, 11 Pro Max

BGA Reballing Mechanic, iBGA Max 6 in 1, iPhone X, Xs, Xs Max, 11, 11 Pro, 11 Pro Max

833,99 Lei
Livrare gratuita
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Set 27 site BGA Reballing OKYN1115-6

Set 27 site BGA Reballing OKYN1115-6

55,00 Lei
Livrare Marți, 31 Mar
BGA Reballing iPhone 7 - Chipset Reballing iPhone 7, Piese Telefon, BGA de Calitate

BGA Reballing iPhone 7 - Chipset Reballing iPhone 7, Piese Telefon, BGA de Calitate

32,38 Lei
Livrare gratuita la comenzile de 375 lei
Livrare Luni, 30 Mar

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Kit BGA Reballing WL A7 iPhone 5/5C/5S - Fixture de calitate superioara

Kit BGA Reballing WL A7 iPhone 5/5C/5S - Fixture de calitate superioara

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BGA Reballing Amaoe iP Face BGA Reballing

BGA Reballing Amaoe iP Face BGA Reballing

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Kit BGA Reballing WL A9-1 CPU Upper Lower, Piese Telefon - Fixture de calitate superioara

Kit BGA Reballing WL A9-1 CPU Upper Lower, Piese Telefon - Fixture de calitate superioara

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BGA Reballing BGA Reballing Mechanic Using the Latest CNC Production Xs Max Pro

BGA Reballing BGA Reballing Mechanic Using the Latest CNC Production Xs Max Pro

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Amaoe BGA Reballing Samsung S7 Edge G935 - Chipset Telefon

Amaoe BGA Reballing Samsung S7 Edge G935 - Chipset Telefon

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Amaoe BGA Reballing iPhone 11, 11 Pro, 11 Pro Max - Kit Refacere BGA Chipset

Amaoe BGA Reballing iPhone 11, 11 Pro, 11 Pro Max - Kit Refacere BGA Chipset

64,78 Lei
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BGA Reballing iPhone 11 - 11 Pro Max, BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip, Net Thickness Heat 0.12mm

BGA Reballing iPhone 11 - 11 Pro Max, BGA Stencil Reballing A13 CPU RAM Nand Flash IC Chip, Net Thickness Heat 0.12mm

50,38 Lei
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BGA Reballing Samsung Galaxy S7 Edge G935 S5050 Chipset

BGA Reballing Samsung Galaxy S7 Edge G935 S5050 Chipset

32,38 Lei
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BGA Reballing Samsung Galaxy S8 G950 S5051 - Chipset Reparatie Telefon

BGA Reballing Samsung Galaxy S8 G950 S5051 - Chipset Reparatie Telefon

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BGA Reballing Sita BGA, iPhone X

BGA Reballing Sita BGA, iPhone X

34,18 Lei
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Set Reballing BGA iPhone (21 piese) - Site BGA

Set Reballing BGA iPhone (21 piese) - Site BGA

170,98 Lei
Livrare gratuita la comenzile de 375 lei
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BGA Reballing AMAOE Magnetic Reballing Kit With BGA Stencil Platform for iPhone 6-X

BGA Reballing AMAOE Magnetic Reballing Kit With BGA Stencil Platform for iPhone 6-X

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BGA Reballing WL A11 CPU Upper Lower, Piese Telefon, Reballing CPU

BGA Reballing WL A11 CPU Upper Lower, Piese Telefon, Reballing CPU

53,91 Lei
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Șablon Reballing BGA WL iPhone XS, XS Max, XR - Reflow Chipset

Șablon Reballing BGA WL iPhone XS, XS Max, XR - Reflow Chipset

52,18 Lei
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BGA Reballing WL PCIE Baseband, Reballing Stencil for iPhone Xs,Xs Max, XR

BGA Reballing WL PCIE Baseband, Reballing Stencil for iPhone Xs,Xs Max, XR

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Kit BGA Reballing 3D iPhone XS/XR - Piese Telefon de Calitate

Kit BGA Reballing 3D iPhone XS/XR - Piese Telefon de Calitate

154,78 Lei
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Matrita BGA Reballing iPhone 7 / 7 Plus, BGA, MJ - Piese Telefon

Matrita BGA Reballing iPhone 7 / 7 Plus, BGA, MJ - Piese Telefon

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Kit BGA Reballing 3D iPhone 7 - Piese Telefon - Calitate Superioara

Kit BGA Reballing 3D iPhone 7 - Piese Telefon - Calitate Superioara

152,98 Lei
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BGA Reballing iPhone 11 - 11 Pro Max, dot matrix Face IC, iPhone X - Xs Max, primary color dot matrix

BGA Reballing iPhone 11 - 11 Pro Max, dot matrix Face IC, iPhone X - Xs Max, primary color dot matrix

64,78 Lei
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BGA Reballing WL:CX-7-1 iPhone 7 - Kit Reflow Chipset Reparatii Placa Baza

BGA Reballing WL:CX-7-1 iPhone 7 - Kit Reflow Chipset Reparatii Placa Baza

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Set Bile BGA Reballing WL CX-A8-1 iPhone 6/6 Plus CPU Upper Lower

Set Bile BGA Reballing WL CX-A8-1 iPhone 6/6 Plus CPU Upper Lower

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BGA Reballing Mechanic, iSmt Series Steel Stencil 3 in 1, iPhone XR, Xs, Xs Max

BGA Reballing Mechanic, iSmt Series Steel Stencil 3 in 1, iPhone XR, Xs, Xs Max

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BGA Reballing WL:CX-5-5S-1 iPhone 5/5S - Kit Refacere Chipset, Piese Telefon de Calitate

BGA Reballing WL:CX-5-5S-1 iPhone 5/5S - Kit Refacere Chipset, Piese Telefon de Calitate

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BGA Reballing Mechanic, iSmt Series Steel Stencil 2 in 1, iPhone 11 Pro, 11 Pro Max

BGA Reballing Mechanic, iSmt Series Steel Stencil 2 in 1, iPhone 11 Pro, 11 Pro Max

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BGA Reballing WL CX-A10-1 iPhone 7/7 Plus CPU - Piese Telefoane

BGA Reballing WL CX-A10-1 iPhone 7/7 Plus CPU - Piese Telefoane

53,91 Lei
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Consumabile 1.5M x 2.5 mm Mechanic Original Sucking Line BGA Desoldering Solder Wire BGA Tin Absorbtion Line For PCB Board Solder Clean Tool
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Consumabile 1.5M x 2.5 mm Mechanic Original Sucking Line BGA Desoldering Solder Wire BGA Tin Absorbtion Line For PCB Board Solder Clean Tool

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Livrare gratuita la comenzile de 375 lei
Consumabile 1.5 M X 3.0 mm Mechanic Original Sucking Line BGA Desoldering Solder Wire BGA Tin Absorbtion Line For PCB Board Solder Clean Tool
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Consumabile 1.5 M X 3.0 mm Mechanic Original Sucking Line BGA Desoldering Solder Wire BGA Tin Absorbtion Line For PCB Board Solder Clean Tool

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