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BGA Reballing AMAOE Magnetic Reballing Kit With BGA Stencil Platform for iPhone 6-X

BGA Reballing AMAOE Magnetic Reballing Kit With BGA Stencil Platform for iPhone 6-X

287,99 Lei
Livrare gratuita la comenzile de 475 lei
Livrare Miercuri, 21 Oct
BGA Reballing BGA Reballing Mechanic Using the Latest CNC Production Xs Max Pro

BGA Reballing BGA Reballing Mechanic Using the Latest CNC Production Xs Max Pro

235,49 Lei
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BGA Reballing Sita BGA, iPhone X

BGA Reballing Sita BGA, iPhone X

34,18 Lei
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Livrare Miercuri, 21 Oct
Amaoe BGA Reballing iPhone 11, 11 Pro, 11 Pro Max - Kit Refacere BGA Chipset

Amaoe BGA Reballing iPhone 11, 11 Pro, 11 Pro Max - Kit Refacere BGA Chipset

64,78 Lei
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Livrare Miercuri, 21 Oct

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Incarcator Laptop, Sony, Vaio VPCEH2BGA, 19.5V, 4.74A, 90W, mufa 6.0x4.4mm

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Main BN41-01955 BN94-06672K Din UE46F5070SS ecran HF460BGA-B1 T460HVF02.1

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Cositor Granulat BGA (Bilute) 0.2 mm

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Memorie FLASH 128Mb INFINEON (CYPRESS) S29GL128P11FFI020 BGA64 Paralel CFI

Memorie FLASH 128Mb INFINEON (CYPRESS) S29GL128P11FFI020 BGA64 Paralel CFI

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Memorie FLASH Paralela Microchip 32MB, 70ns, BGA48, SST39VF3201B-70-4I-B3KE, 2.7-3.6V

Memorie FLASH Paralela Microchip 32MB, 70ns, BGA48, SST39VF3201B-70-4I-B3KE, 2.7-3.6V

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Duză aer cald THERMALTRONICS 13x13mm pentru BGA - Cod HTN-B1313

Duză aer cald THERMALTRONICS 13x13mm pentru BGA - Cod HTN-B1313

Tip duza: aer cald Dimensiune: 13x13mm Compatibilitate: bga Cod produs: htn-b1313
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Placa video laptop second hand NVIDIA N17M-Q3-A2 GeForce M620 BGA Chipset BM3G58 REV 1.0 Lenovo ThinkPad P71 2GB

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Statie BGA IR TBK R2201

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Procesor Laptop Intel Celeron T3100, Dual Core, Socket PGA478/BGA479, SLGEY

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Set reparatii electronice BST-85, BGA, cutit precis, spatula cositor, perii si accesorii pentru telefoane si PCB

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BGA Reballing iPhone 11 - 11 Pro Max, dot matrix Face IC, iPhone X - Xs Max, primary color dot matrix

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BGA Reballing WL:CX-7-1 iPhone 7 - Kit Reflow Chipset Reparatii Placa Baza

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Kit BGA Reballing 3D iPhone XS/XR - Piese Telefon de Calitate

Kit BGA Reballing 3D iPhone XS/XR - Piese Telefon de Calitate

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Set Bile BGA Reballing WL CX-A8-1 iPhone 6/6 Plus CPU Upper Lower

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Kit BGA Reballing WL A7 iPhone 5/5C/5S - Fixture de calitate superioara

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BGA Reballing Mechanic, iSmt Series Steel Stencil 3 in 1, iPhone XR, Xs, Xs Max

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BGA Reballing Samsung Galaxy S7 Edge G935 S5050 Chipset

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BGA Reballing WL:CX-5-5S-1 iPhone 5/5S - Kit Refacere Chipset, Piese Telefon de Calitate

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BGA Reballing WL A11 CPU Upper Lower, Piese Telefon, Reballing CPU

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BGA Reballing Mechanic, iSmt Series Steel Stencil 2 in 1, iPhone 11 Pro, 11 Pro Max

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BGA Reballing Samsung Galaxy S8 G950 S5051 - Chipset Reparatie Telefon

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Șablon Reballing BGA WL iPhone XS, XS Max, XR - Reflow Chipset

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Amaoe BGA Reballing Samsung S7 Edge G935 - Chipset Telefon

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BGA Reballing WL CX-A10-1 iPhone 7/7 Plus CPU - Piese Telefoane

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Kit BGA Reballing 3D iPhone 7 - Piese Telefon - Calitate Superioara

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Scule Service Anti-Static Brush, Double Head Insulation Hard Brush For Phone PCB BGA

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Procesor Intel Core i7-7700HQ (SR32Q), BGA, Second Hand

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Bandă de dezlipit ESD CHEMTronics 2.8mm x 1.5m, din cupru, flux No Clean, Lead Free, pentru PCB BGA

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Tip produs: banda de dezlipit ESD: da Material: cupru Lungime: 1.5m La?ime: 2.8mm
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