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Bga

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BGA Reballing AMAOE Magnetic Reballing Kit With BGA Stencil Platform for iPhone 6-X

BGA Reballing AMAOE Magnetic Reballing Kit With BGA Stencil Platform for iPhone 6-X

287,99 Lei
Livrare gratuita la comenzile de 475 lei
Livrare Joi, 22 Oct
BGA Reballing BGA Reballing Mechanic Using the Latest CNC Production Xs Max Pro

BGA Reballing BGA Reballing Mechanic Using the Latest CNC Production Xs Max Pro

235,49 Lei
Livrare gratuita la comenzile de 475 lei
Livrare Joi, 22 Oct
BGA Reballing Sita BGA, iPhone X

BGA Reballing Sita BGA, iPhone X

34,18 Lei
Livrare gratuita la comenzile de 475 lei
Livrare Joi, 22 Oct
Amaoe BGA Reballing iPhone 11, 11 Pro, 11 Pro Max - Kit Refacere BGA Chipset

Amaoe BGA Reballing iPhone 11, 11 Pro, 11 Pro Max - Kit Refacere BGA Chipset

64,78 Lei
Livrare gratuita la comenzile de 475 lei
Livrare Joi, 22 Oct

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Romania 1917, 5 LEI BGA Banca Generala Romana, WWI, Ocupatia Germana, P#M5, XF+! RARA!!!

Romania 1917, 5 LEI BGA Banca Generala Romana, WWI, Ocupatia Germana, P#M5, XF+! RARA!!!

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Incarcator Laptop, Sony, Vaio VPCEH2BGA, 19.5V, 4.74A, 90W, mufa 6.0x4.4mm

Incarcator Laptop, Sony, Vaio VPCEH2BGA, 19.5V, 4.74A, 90W, mufa 6.0x4.4mm

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Main BN41-01955 BN94-06672K Din UE46F5070SS ecran HF460BGA-B1 T460HVF02.1

Main BN41-01955 BN94-06672K Din UE46F5070SS ecran HF460BGA-B1 T460HVF02.1

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Main BN49-08841E BN41-02098B Samsung UE32J5100 Ecran GH032BGA-B5 T320HVF05.9

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Cositor Granulat BGA (Bilute) 0.2 mm

Cositor Granulat BGA (Bilute) 0.2 mm

37,00 Lei
Livrare gratuita la comenzile de 300 lei
Livrare Vineri, 23 Oct
Memorie FLASH 128Mb INFINEON (CYPRESS) S29GL128P11FFI020 BGA64 Paralel CFI

Memorie FLASH 128Mb INFINEON (CYPRESS) S29GL128P11FFI020 BGA64 Paralel CFI

77,75 Lei
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Memorie FLASH Paralela Microchip 32MB, 70ns, BGA48, SST39VF3201B-70-4I-B3KE, 2.7-3.6V

Memorie FLASH Paralela Microchip 32MB, 70ns, BGA48, SST39VF3201B-70-4I-B3KE, 2.7-3.6V

Tip produs: memorie flash Capacitate: 32mb Tip Interfa?a: paralel Timp Acces: 70ns Carcasa: bga48
34,69 Lei
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Duză aer cald THERMALTRONICS 13x13mm pentru BGA - Cod HTN-B1313

Duză aer cald THERMALTRONICS 13x13mm pentru BGA - Cod HTN-B1313

Tip duza: aer cald Dimensiune: 13x13mm Compatibilitate: bga Cod produs: htn-b1313
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Placa video laptop second hand NVIDIA N17M-Q3-A2 GeForce M620 BGA Chipset BM3G58 REV 1.0 Lenovo ThinkPad P71 2GB

Placa video laptop second hand NVIDIA N17M-Q3-A2 GeForce M620 BGA Chipset BM3G58 REV 1.0 Lenovo ThinkPad P71 2GB

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Statie BGA IR TBK R2201

Statie BGA IR TBK R2201

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Procesor Laptop Intel Celeron T3100, Dual Core, Socket PGA478/BGA479, SLGEY

Procesor Laptop Intel Celeron T3100, Dual Core, Socket PGA478/BGA479, SLGEY

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Set reparatii electronice BST-85, BGA, cutit precis, spatula cositor, perii si accesorii pentru telefoane si PCB

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BGA Reballing iPhone 11 - 11 Pro Max, dot matrix Face IC, iPhone X - Xs Max, primary color dot matrix

BGA Reballing iPhone 11 - 11 Pro Max, dot matrix Face IC, iPhone X - Xs Max, primary color dot matrix

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BGA Reballing WL:CX-7-1 iPhone 7 - Kit Reflow Chipset Reparatii Placa Baza

BGA Reballing WL:CX-7-1 iPhone 7 - Kit Reflow Chipset Reparatii Placa Baza

53,91 Lei
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Kit BGA Reballing 3D iPhone XS/XR - Piese Telefon de Calitate

Kit BGA Reballing 3D iPhone XS/XR - Piese Telefon de Calitate

154,78 Lei
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Livrare Joi, 22 Oct
Set Bile BGA Reballing WL CX-A8-1 iPhone 6/6 Plus CPU Upper Lower

Set Bile BGA Reballing WL CX-A8-1 iPhone 6/6 Plus CPU Upper Lower

53,91 Lei
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Kit BGA Reballing WL A7 iPhone 5/5C/5S - Fixture de calitate superioara

Kit BGA Reballing WL A7 iPhone 5/5C/5S - Fixture de calitate superioara

53,91 Lei
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BGA Reballing Mechanic, iSmt Series Steel Stencil 3 in 1, iPhone XR, Xs, Xs Max

BGA Reballing Mechanic, iSmt Series Steel Stencil 3 in 1, iPhone XR, Xs, Xs Max

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BGA Reballing Samsung Galaxy S7 Edge G935 S5050 Chipset

BGA Reballing Samsung Galaxy S7 Edge G935 S5050 Chipset

32,38 Lei
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Kit BGA Reballing WL A9-1 CPU Upper Lower, Piese Telefon - Fixture de calitate superioara

Kit BGA Reballing WL A9-1 CPU Upper Lower, Piese Telefon - Fixture de calitate superioara

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BGA Reballing WL:CX-5-5S-1 iPhone 5/5S - Kit Refacere Chipset, Piese Telefon de Calitate

BGA Reballing WL:CX-5-5S-1 iPhone 5/5S - Kit Refacere Chipset, Piese Telefon de Calitate

53,91 Lei
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BGA Reballing WL A11 CPU Upper Lower, Piese Telefon, Reballing CPU

BGA Reballing WL A11 CPU Upper Lower, Piese Telefon, Reballing CPU

53,91 Lei
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BGA Reballing Mechanic, iSmt Series Steel Stencil 2 in 1, iPhone 11 Pro, 11 Pro Max

BGA Reballing Mechanic, iSmt Series Steel Stencil 2 in 1, iPhone 11 Pro, 11 Pro Max

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BGA Reballing Samsung Galaxy S8 G950 S5051 - Chipset Reparatie Telefon

BGA Reballing Samsung Galaxy S8 G950 S5051 - Chipset Reparatie Telefon

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Șablon Reballing BGA WL iPhone XS, XS Max, XR - Reflow Chipset

Șablon Reballing BGA WL iPhone XS, XS Max, XR - Reflow Chipset

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Amaoe BGA Reballing Samsung S7 Edge G935 - Chipset Telefon

Amaoe BGA Reballing Samsung S7 Edge G935 - Chipset Telefon

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Livrare Joi, 22 Oct
BGA Reballing WL PCIE Baseband, Reballing Stencil for iPhone Xs,Xs Max, XR

BGA Reballing WL PCIE Baseband, Reballing Stencil for iPhone Xs,Xs Max, XR

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BGA Reballing WL CX-A10-1 iPhone 7/7 Plus CPU - Piese Telefoane

BGA Reballing WL CX-A10-1 iPhone 7/7 Plus CPU - Piese Telefoane

53,91 Lei
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Kit BGA Reballing 3D iPhone 7 - Piese Telefon - Calitate Superioara

Kit BGA Reballing 3D iPhone 7 - Piese Telefon - Calitate Superioara

152,98 Lei
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Scule Service Anti-Static Brush, Double Head Insulation Hard Brush For Phone PCB BGA

Scule Service Anti-Static Brush, Double Head Insulation Hard Brush For Phone PCB BGA

35,98 Lei
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Procesor Intel Core i7-7700HQ (SR32Q), BGA, Second Hand

Procesor Intel Core i7-7700HQ (SR32Q), BGA, Second Hand

700,00 Lei
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(100,00% / 3.010)
Urmarit de 1 utilizator
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Bandă de dezlipit ESD CHEMTronics 2.8mm x 1.5m, din cupru, flux No Clean, Lead Free, pentru PCB BGA

Bandă de dezlipit ESD CHEMTronics 2.8mm x 1.5m, din cupru, flux No Clean, Lead Free, pentru PCB BGA

Tip produs: banda de dezlipit ESD: da Material: cupru Lungime: 1.5m La?ime: 2.8mm
73,14 Lei
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Livrare Joi, 22 Oct
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